Kishk, A. ., Zaman, A. U. ., & Kildal, P.-S. . (2022). Numerical Prepackaging with PMC Lid - Efficient and Simple Design Procedure for Microstrip Circuits Including the Packaging. Applied Computational Electromagnetics Society Journal (ACES), 27(05), 389–398. Retrieved from https://journals.riverpublishers.com/index.php/ACES/article/view/13369