AVALI GHOSH; SISIR KUMAR DAS; ANNAPURNA DAS. Interference Effects of Via Interconnect in Three Layer Printed Circuit Board. Applied Computational Electromagnetics Society Journal (ACES), [S. l.], v. 33, n. 09, p. 1040–1047, 2021. Disponível em: https://journals.riverpublishers.com/index.php/ACES/article/view/9015. Acesso em: 13 may. 2026.