YUPENG LIU; LEI XIA; RUIMIN XU. A Broadband Microstrip-to-Microstrip Vertical Via Interconnection for Low Temperature Co-Fired Ceramic Applications. Applied Computational Electromagnetics Society Journal (ACES), [S. l.], v. 32, n. 12, p. 1156–1159, 2021. Disponível em: https://journals.riverpublishers.com/index.php/ACES/article/view/9417. Acesso em: 22 apr. 2026.