KISHK, A. .; ZAMAN, A. U. .; KILDAL, P.-S. . Numerical Prepackaging with PMC Lid - Efficient and Simple Design Procedure for Microstrip Circuits Including the Packaging. Applied Computational Electromagnetics Society Journal (ACES), [S. l.], v. 27, n. 05, p. 389–398, 2022. Disponível em: https://journals.riverpublishers.com/index.php/ACES/article/view/13369. Acesso em: 2 jun. 2026.