RUN XIONG; QIN YIN; WEN YANG; YAN LIU; JUN LI. Improvement of Shaped Conductive Backfill Material for Grounding Systems. Applied Computational Electromagnetics Society Journal (ACES), [S. l.], v. 36, n. 4, p. 442–449, 2021. Disponível em: https://journals.riverpublishers.com/index.php/ACES/article/view/7307. Acesso em: 1 may. 2026.