AVALI GHOSH; SISIR KUMAR DAS; ANNAPURNA DAS. Modeling of Via Interconnect through Pad in Printed Circuit Board. Applied Computational Electromagnetics Society Journal (ACES), [S. l.], v. 34, n. 05, p. 771–776, 2019. Disponível em: https://journals.riverpublishers.com/index.php/ACES/article/view/8491. Acesso em: 16 aug. 2024.