Run Xiong, Qin Yin, Wen Yang, Yan Liu, and Jun Li. 2021. “Improvement of Shaped Conductive Backfill Material for Grounding Systems”. Applied Computational Electromagnetics Society Journal (ACES) 36 (4):442-49. https://journals.riverpublishers.com/index.php/ACES/article/view/7307.