Avali Ghosh, Sisir Kumar Das, and Annapurna Das. “Interference Effects of Via Interconnect in Three Layer Printed Circuit Board”. Applied Computational Electromagnetics Society Journal (ACES), vol. 33, no. 09, July 2021, pp. 1040-7, https://journals.riverpublishers.com/index.php/ACES/article/view/9015.