Avali Ghosh, Sisir Kumar Das, and Annapurna Das. “Modeling of Via Interconnect through Pad in Printed Circuit Board”. Applied Computational Electromagnetics Society Journal (ACES) 34, no. 05 (May 1, 2019): 771–776. Accessed September 18, 2024. https://journals.riverpublishers.com/index.php/ACES/article/view/8491.