Yupeng Liu, Lei Xia, Ruimin Xu. A Broadband Microstrip-to-Microstrip Vertical Via Interconnection for Low Temperature Co-Fired Ceramic Applications. ACES Journal [Internet]. 2021 Jul. 30 [cited 2026 Apr. 22];32(12):1156-9. Available from: https://journals.riverpublishers.com/index.php/ACES/article/view/9417