Submissions

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Submission Preparation Checklist

As part of the submission process, authors are required to check off their submission's compliance with all of the following items, and submissions may be returned to authors that do not adhere to these guidelines.
  • This is an open access journal and incurs publication charges payable by the author. ACES Members: $300. Non-Members: $500.  Overpage charges $60 per page above 6 pages. Fees payable after acceptance and before publication.
  • The submission has not been previously published, nor is it before another journal for consideration (or an explanation has been provided in Comments to the Editor).
  • The submission follows the ACES Journal template.
  • The initial submission file is in PDF file format. Once your paper is accepted you will be asked for either a MS Word or LaTex file of your paper.
  • All figures and tables included in your paper have also been uploaded as separate files.
  • Author photographs have been uploaded as separate files.
  • A separate document containing all author biographies has been uploaded.
  • Where available, URLs for the references have been provided.

Author Guidelines

  • The submission follows the ACES Journal Template.
  • The submission file is in PDF format.
  • A resolution of at least 500 dpi is required for artwork / images
  • All illustrations, figures, and tables are placed within the text at the appropriate points, rather than at the end.
  • As of April 1, 2015 corresponding authors will not have a free membership in the society for publishing in the Journal.

 

 

Articles

Please select at least 2 keyword categories from below. This will aid in our selection of reviewers.

FDM2023

You have selected to submit your paper to the 

SPECIAL ISSUE: Finite Difference Methodologies for Microwave, Optical and Photonics, and Superconducting Device Design

You do not need to complete the "Categories" section below.

Please go directly to "Submission Requirements" further below.

Metamaterials and Metadevices for Integrated Sensing, Imaging, and Communication

You have selected to submit your paper to the 

SPECIAL ISSUE: Metamaterials and Metadevices for Integrated Sensing, Imaging, and Communication

You do not need to complete the "Categories" section below.

Please go directly to "Submission Requirements" further below.

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