Microstrip Dielectric Substrate Material Characterization with Temperature Effect
Keywords:
Measurement method, microstrip line, relative permittivity, substrate material, temperature effect.Abstract
This paper describes a dielectric substrate materials electromagnetic (EM) characterization method in the ultra-wideband (UWB) frequencies from DC to 5 GHz by taking into account the temperature influence. The proposed method theoretical principle is described and fundamentally built with the analytical formulation from the microstrip transmission line (TL) theory. From this basic concept, the analytical equations enabling to determine the dielectric material relative permittivity and loss tangent from the given S-parameters are established. The characterization method is validated with numerical and experimental tests. As proof of concept, a prototype of microstrip TL printed on FR4 epoxy substrate was designed, fabricated and experimented. The relative permittivity and loss tangent were extracted in the UWB frequency from DC to 5 GHz in the range of temperature varied from 40°C to 140°C. This innovative characterization method is useful for the investigation on the frequency dependent and especially by taking into account the temperature influence on the substrate materials; for example, during the microstrip circuits design phase.
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K. Banerjee, A. Mehrotra, A. SangiovanniVincentelli, and H. Chenming, “On thermal effects in deep sub-micron VLSI interconnects,” Proc. 36th ACM/IEEE-CAS/ EDAC Design Automation Conf., New Orleans, LA, USA, pp. 885-891, June 21-25, 1999.
Y. Cheng, C. Tsai, C. Teng, and S. Kang, Electrothermal Analysis of VLSI Systems, Kluwer Academic Publishers, Boston/Dordretch/London, 2000.
H. A. Schafft, “Thermal analysis of electromigration test structures,” IEEE Trans. on Electron Device, vol. Ed-34, no. 3, pp. 664-672, 1987.
A. A. Bilotti, “Static temperature distribution in IC chips with isothermal heat sources,” IEEE Trans. on Electron Device, vol. Ed-21, no. 3, pp. 217-226, 1974.
A. H. Ajami, M. Pedram, and K. Banerjee, “Effects of non-uniform substrate temperature on the clock signal integrity in high performance designs,” Proc. IEEE Conf. Custom Integrated Circuits, San Diego, CA, USA, pp. 233-236, May 6-9, 2001.
J. R. Miller, Y. Li, K. Hinckley, G. Blando, B. Guenin, I. Novak, A. Dengi, A. Rebelo, and S. McMorrow, “Temperature and moisture dependence of PCB and package traces and the impact on signal performance,” Proc. of Design Con. 2012, Santa Clara, CA, USA, pp. 1-27, Jan. 30 - Feb. 2, 2012.
J. Zhang and T. Y. Hsiang, “Extraction of subterahertz transmission-line parameters of coplanar waveguides,” Progress In Electromagnetics Research Symposium (PIERS) Online, vol. 3, no. 7, Beijing, China, pp. 1102-110, Mar. 26-30, 2007.
A. H. Ajami, K. Banerjee, M. Pedram, and L. P. P. P. van Ginneken, “Analysis of non-uniform temperature-dependent interconnect performance in high-performance ICs,” Proc. 38th ACM/IEEECAS/EDAC Design Automation Conference (DAC’01), Las Vegas, NV, USA, pp. 567-572, June 18-22, 2001.
B. Ravelo, A. Perennec, M. Le Roy, and Y. Boucher, “Active microwave circuit with negative group delay,” IEEE Microwave Wireless Component Letters, vol. 17, no. 12, pp. 861-863, Dec. 2007.
L. F. Chen, C. K. Ong, C. P. Neo, V. V. Varadan, and V. K. Varadan, Microwave Electronics: Measurement and Materials Characterization, Wiley, NJ, USA, Jan. 2005.
R. K. Challa, D. Kajfez, J. R. Gladden, A. Z. Elsherbeni, and V. Demir, “Permittivity measurement with a non-standard waveguide by using TRL calibration and fractional linear data fitting”, Progress In Electromagnetics Research (PIER) B, vol. 2, pp. 1-13, 2008.
J. Hinojosa, “S-Parameter broadband measurements on-coplanar and fast extraction of the substrate intrinsic properties,” IEEE Microwave Wireless Component Letters, vol. 11, no. 2, pp. 80-82, 2001.
A. Kumar and G. Singh, “Measurement of dielectric constant and loss factor of the dielectric material at microwave frequencies,” Progress In Electromagnetics Research (PIER), vol. 69, pp. 47-54, 2007.
X.-C. Zhu, W. Hong, K. Wu, H.-J. Tang, Z.-C. Hao, and H.-X. Zhou, “Characterization of substrate material using complementary split ring resonators at terahertz frequencies,” Proc. of IEEE Int. Wireless Symp. (IWS) 2013, Beijing, China, pp. 1-4, Apr. 14-18, 2013.
J. Krupka, J. Breeze, A. Centeno, N. Alford, T. Claussen, and L. Jensen, “Measurements of permittivity, dielectric loss tangent, and resistivity of float-zone silicon at microwave frequencies,” IEEE Trans. Microwave Theory and Techniques, vol. 54, no. 11, pp. 3995-4001, Nov. 2006.
T. Eudes, B. Ravelo, and A. Louis, “Experimental validations of a simple PCB interconnect model for high-rate signal integrity,” IEEE Trans. Electromagnetic Compatibility, vol. 54, no. 2, pp. 397-404, Apr. 2012.
I. J. Bahl and D. K. Trivedi, “A designer’s guide to microstrip line,” Microwaves, pp. 174-182, May 1977.
C. D. Raj, G. S. Rao, P. V. Y. Jayasree, B. Srinu, and P. Lakshman, “Estimation of reflectivity and shielding effectiveness of three layered laminate electromagnetic shield at X-band,” Progress In Electromagnetics Research (PIER) B, vol. 20, pp. 205-223, 2010.
C. Morari, I. Balan, J. Pintea, E. Chitanu, and I. Iordache, “Electrical conductivity and electromagnetic shielding effectiveness of silicone rubber filled with ferrite and graphite powders,” Progress In Electromagnetics Research (PIER) M, vol. 21, pp. 93-104, 2011.
K. Lakshmi, H. John, K. T. Mathew, R. Joseph, and K. E. George, “Microwave absorption, reflection and EMI shielding of PU/PANI composite,” Journal of Acta Materialia, vol. 57, pp. 371-375, 2009.
M. Y. Koledintseva, J. Drewniak, and R. DuBroff, “Modelling of shielding composite materials and structures for microwave frequencies,” Progress In Electromagnetics Research (PIER) B, vol. 15, pp. 197-215, 2009.
V. Preault, R. Corcolle, L. Daniel, and L. Pichon, “Shielding effectiveness of composite materials: effect of inclusion shape,” IEEE Trans. Magnetics, vol. 49, no. 5, pp. 1941-1944, May 2013.
