A Closed-Form Spatial Green’s Function for the Thick Microstrip Substrate: The Meshless Interpolation Approach

Authors

  • B. Honarbakhsh Department of Electrical Engineering Amirkabir University of Technology (Tehran Polytechnic), Tehran, IRAN
  • A. Tavakoli Institute of Communications Technology and Applied Electromagnetics Amirkabir University of Technology (Tehran Polytechnic), Tehran, IRAN

Keywords:

Microstrip, integral equation, IQ, RBF, Sommerfeld integral

Abstract

In this paper the Green’s functions (GFs) of a thick microstrip in the spatial-domain is computed based on expanding the corresponding spectral-domain functions over inverse quadric (IQ) radial basis functions (RBFs). The scattered data interpolation ability of RBFs is exploited for efficient sampling of the Sommerfeld integration path (SIP), passing from close vicinity of singularities in the complex k? plane. By this, the information content of spectral-domain GFs is preserved, which makes it possible to compute the far-fields accurately. Thus, the method can be applied to the analysis of electrically large structures near layered media. The proposed method is direct with only one approximation level.

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Published

2021-10-06

How to Cite

[1]
B. . Honarbakhsh and A. . Tavakoli, “A Closed-Form Spatial Green’s Function for the Thick Microstrip Substrate: The Meshless Interpolation Approach”, ACES Journal, vol. 28, no. 02, pp. 91–98, Oct. 2021.

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