Multi-Mode Excitation by Interleaved EBG Structure for Suppression of Power/Ground Noise in Multi-Layer PCBs

Authors

  • Ding-Bing Lin Department of Electronic and Computer Engineering National Taiwan University of Science and Technology, Taipei, Taiwan
  • Yen-Hao Chen Department of Electronic and Computer Engineering National Taiwan University of Science and Technology, Taipei, Taiwan https://orcid.org/0000-0003-1537-0672
  • Min-Hung Hsieh Signal Integrity Engineering Department Inventec Corporation, Taoyuan, Taiwan

DOI:

https://doi.org/10.13052/2022.ACES.J.370511

Keywords:

Electromagnetic bandgap, microwave filter, power/ground noise, signal integrity

Abstract

Signal line transition with layer transition via is inevitable in multi-layer PCB. The return current can generate voltage noise between the cavities due to the discontinuity of the return current path. Other layer transition vias passing through the cavity can pick up the voltage noise and result in problems of signal integrity. In this paper, an electromagnetic bandgap (EBG) structure is proposed for suppression of the broadband cavity noise. The impedance discontinuity between layers of interleaved EBG cell enhances the efficiency of noise suppression, and the slots embedded in the EBG cell excite multi-mode resonances for extending the bandwidth of noise suppression. The dispersion diagram is utilized to preliminarily analyze the characteristic of the proposed EBG cell, and a 5×5 cells EBG board is further analyzed for characterizing the efficiency of noise suppression. Both simulation and measurement results prove the proposed structure can effectively suppress the cavity noise under −35 dB over the frequency range from 0.56 GHz to the highest measurement frequency, 20 GHz.

Downloads

Download data is not yet available.

Author Biographies

Ding-Bing Lin, Department of Electronic and Computer Engineering National Taiwan University of Science and Technology, Taipei, Taiwan

Ding-Bing Lin received the M.S. and Ph.D. degrees in electrical engineering from National Taiwan University, Taipei, Taiwan, in 1989 and 1993, respectively.

From 1993 to 2016, he was a Faculty Member with the Department of Electronic Engineering, National Taipei University of Technology, Taipei, Taiwan, where he was an Associate Professor, Professor, and Distinguished Professor in 1993, 2005, and 2014, respectively. Since August 2016, he has been a Professor with the Department of Electronic and Computer Engineering, National Taiwan University of Science and Technology.

Dr. Lin was the Chair of the Taipei Chapter, IEEE Broadcasting Society, from 2010 to 2014, the Technical Program Committee Chair of the 2015 Asia-Pacific International EMC Symposium, and the Chair of the Taipei Chapter, IEEE EMC Society from 2015 to 2018. He has been an Associate Editor for the IEEE Transactions on EMC since 2019 and in the Editorial Board of the International Journal of Antennas and Propagation since 2014. He is currently directing a human resources cultivation program named the Promotion Center for 5G Antennas and Radio Frequency Techniques Consortium. He has authored or coauthored more than 200 papers in international journals and at international conferences, respectively. His research interests include wireless communication, radio multipath fading channel modeling, mobile antennas, high-speed digital transmission, and microwave engineering.

Yen-Hao Chen, Department of Electronic and Computer Engineering National Taiwan University of Science and Technology, Taipei, Taiwan

Yen-Hao Chen received the M.S. degree in computer, communication, and control engineering from the National Taipei University of Technology, Taipei, Taiwan, in 2003. He is currently working toward the Ph.D. degree in electronic and computer engineering with the National Taiwan University of Science and Technology, Taipei, Taiwan.

He has been working with Inventec Corporation since 2003 where his responsibilities include the design and analysis of signal and power integrity for products of servers, network switches, and storage equipment. His research interests include SI/PI simulations and noise modeling of switched-mode power supply.

Min-Hung Hsieh, Signal Integrity Engineering Department Inventec Corporation, Taoyuan, Taiwan

Min-Hung Hsieh received the M.S. degree in electronic and computer engineering from the National Taiwan University of Science and Technology, Taipei, Taiwan, in 2018.

He has been working with Inventec Corporation since 2019 where his responsibilities include the design and analysis of signal integrity for industrial servers. His current interests include SI/PI simulations for PCIe and DDR signals.

References

L. D. Smith and E. Bogatin, “Taming signal integrity problems when signals change return planes,” Principles of Power Integrity for PDN Design, 1st ed., Prentice Hall, Boston, Massachusetts, USA, pp. 363-426, 2017.

K. Koo, L. G. Romo, T. Wang, T. Michalka, and J. Drewniak, “Fast decap assignment algorithm for optimization of power distribution networks,” 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, pp. 573-578, 2017.

T. Wu, Y. Lin, and S. Chen, “A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures,” IEEE Microwave and Wireless Components Letters, vol. 14, no. 7, pp. 337-339, Jul. 2004.

C. Wang, G. Shiue, W. Guo, and R. Wu, “A systematic design to suppress wideband ground bounce noise in high-speed circuits by electromagnetic-bandgap-enhanced split powers,” IEEE Transactions on Microwave Theory and Techniques, vol. 54, no. 12, pp. 4209-4217, Dec. 2006.

F. de Paulis, L. Raimondo, and A. Orlandi, “IR-DROP analysis and thermal assessment of planar electromagnetic bandgap structures for power integrity applications,” IEEE Transactions on Advanced Packaging, vol. 33, no. 3, pp. 617-622, Aug. 2010.

J. Park, A. C. W. Lu, K. M. Chua, L. L. Wai, J. Lee, and J. Kim, “Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP applications,” IEEE Microwave and Wireless Components Letters, vol. 16, no. 9, pp. 481-483, Sep. 2006.

C. Wang and T. Wu, “Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression,” IEEE Transactions on Electromagnetic Compatibility, vol. 55, no. 1, pp. 159-167, Feb. 2013.

G. Ouyang, X. Ye, and T. Nguyen, “Switching voltage regulator noise coupling to signal lines in a server system,” 2010 IEEE International Symposium on Electromagnetic Compatibility, Fort Lauderdale, FL, pp. 72-78, 2010.

V. S. Pandit, W. H. Ryu, and M. Choi, “Signal/power integrity interactions,” Power Integrity for I/O Interfaces: With Signal Integrity/Power Integrity Co-Design, 1st ed., Prentice Hall, Boston, Massachusetts, USA, pp. 233-284, 2011.

Downloads

Published

2022-11-14

How to Cite

[1]
D.-B. . Lin, Y.-H. . Chen, and M.-H. . Hsieh, “Multi-Mode Excitation by Interleaved EBG Structure for Suppression of Power/Ground Noise in Multi-Layer PCBs”, ACES Journal, vol. 37, no. 05, pp. 619–623, Nov. 2022.

Issue

2022: Vol 37 Iss 5

Section

Articles

Categories