A Compact and High-Performance Shielding Enclosure by Using Metamaterial Design

Authors

  • Keyi Cui Department of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing 100876, China
  • Dan Shi Department of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing 100876, China
  • Chi Sun Department of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing 100876, China
  • Xiaoyong Liu Department of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing 100876, China

DOI:

https://doi.org/10.13052/2021.ACES.J.361113

Keywords:

Electromagnetic shielding, fifth generation (5G) wireless systems, frequency selective surfaces, metamaterial, ventilation

Abstract

A compact and high-performance shielding enclosure designed by metamaterial structure based on frequency selective surface (FSS) is proposed. The enclosure has large holes for convenience of airflow and cable access. However, it can achieve great shielding performance by maintaining more than 40 dB attenuation. The shield is composed of n ×× n unit cells, and each unit cell is designed by knitting the 2.5-dimensional loop-type elements interconnected through vias. This design shows promising capability of size reduction, bandwidth expansion, and shielding effectiveness enhancement. Moreover, the enlarged holes on the FSS are helpful for the ventilation and heat dissipation. The size of the proposed 2.5-D FSS is only 0.097λ0λ0××0.097λ0λ0, where λ0λ0 corresponds to free space wavelength of resonance frequency. The proposed structure provides 3.38 GHz (3.21–6.59 GHz) wide shielding bandwidth. Furthermore, it has stable response to the wide-angle incident wave ranging from 0∘∘ to 85∘∘ with more than 40 dB attenuation at 4.83 GHz for both x-polarization and y-polarization. The proposed FSS is practically useful for the shielding of fifth generation (5G) wireless systems, WiMAX, and WLAN.

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Author Biographies

Keyi Cui, Department of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing 100876, China

Keyi Cui was born in Heze, Shandong, China, in 1998. She is currently working toward the master’s degree in electronic engineering from the Beijing University of Posts and Telecommunications, Beijing, China. Her main research interests include metamaterial, metalens, and machine learning.

Dan Shi, Department of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing 100876, China

Dan Shi (Member, IEEE) received the Ph.D. degree in electronic engineering from the Beijing University of Posts & Telecommunications, Beijing, China, in 2008. She has been a Professor with the Beijing University of Posts & Telecommunications. Her interests include electromagnetic compatibility, electromagnetic environment, and electromagnetic computation.

Chi Sun, Department of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing 100876, China

Chi Sun was born in Xi’an, Shanxi, China, in 1996. He received the master’s degree in electronic engineering from the Beijing University of Posts and Telecommunications, Beijing, China, in 2021. His main research content is electromagnetic compatibility and theory, mainly in FSS design for shielding.

Xiaoyong Liu, Department of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing 100876, China

Xiaoyong Liu received the bachelor’s degree in radio technology and information system from Tsinghua University, Beijing, China, in 2002. He is currently working toward the Ph.D. degree in electronic science and technology from the Beijing University of Posts & Telecommunications, Beijing, China. His research interests include electromagnetic compatibility, testing and measurement, and radio frequency spectrum technology.

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Published

2021-12-30

How to Cite

[1]
K. . Cui, D. . Shi, C. . Sun, and X. . Liu, “A Compact and High-Performance Shielding Enclosure by Using Metamaterial Design”, ACES Journal, vol. 36, no. 11, pp. 1484–1491, Dec. 2021.

Issue

2021: Vol 36 Iss 11

Section

Articles