Surface Impedance Boundary Conditions of High Order of Approximation for the Finite Integration Technique

Authors

  • Luca Di Rienzo Dipartimento di Elettrotecnica, Politecnico di Milano, P.zza L. da Vinci, 32, 20133, Milano, Italy;
  • Nathan Ida Department of Electrical Engineering, The University of Akron, Akron, OH 44325-3904, USA;
  • Sergey Yuferev Nokia Corp., P.O. Box 1000, Tampere FIN-34101, Finland; sergey.yuferev@nokia.com

Keywords:

Surface Impedance Boundary Conditions of High Order of Approximation for the Finite Integration Technique

Abstract

Time domain Surface Impedance Boundary Conditions (SIBCs) of high order of approximation relating the electric field integral along the edge of the computational cell and the magnetic flux through its facet are derived and implemented into the Finite Integration Technique (FIT). It enables such effects as curvature of the conductor surface and variation of the electromagnetic field along the interface to be accurately described in the formulation. As a result, accuracy of numerical results is improved and the application area is expanded as compared with formulations employing classical low order Leontovich SIBCs. Numerical results obtained using low- and highorder FIT-SIBC formulations are compared with analytical results to demonstrate the advantages of the proposed approach.

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Published

2022-06-18

How to Cite

[1]
L. D. . Rienzo, N. . Ida, and S. . Yuferev, “Surface Impedance Boundary Conditions of High Order of Approximation for the Finite Integration Technique”, ACES Journal, vol. 22, no. 1, pp. 53–59, Jun. 2022.

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