Introduction of an Adaptive Modeling Technique for the Simulation of RF Structures Requiring the Coupling of Maxwell’s, Mechanical, and Solid-State Equations

Authors

  • Nathan Bushyager School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta, GA 30332-0250 U.S.A.
  • Brian McGarvey School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta, GA 30332-0250 U.S.A.
  • Emmanouil M. Tentzeris School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta, GA 30332-0250 U.S.A.

Keywords:

Introduction of an Adaptive Modeling Technique for the Simulation of RF Structures Requiring the Coupling of Maxwell’s, Mechanical, and Solid-State Equations

Abstract

As RF technologies mature designing complex RF systems is becoming an increasingly difficult task. Modern systems include components that cannot be modeled with traditional simulators. This paper introduces a modeling technique for use in RF systems that combines Maxwell’s, mechanical, and solid-state equations. The resulting simulator can be used to simulate microelectromechanical structures (MEMS) and semiconductor devices. The motion coupling technique is applied to a MEMS parallel plate capacitor for demonstration purposes.

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References

K. S. Yee, “Numerical solution of initial boundary value

problems involving Maxwell’s equations in isotropic

media,” IEEE Transactions on Antennas and

Propagation, vol. AP-14, no.5, pp. 302-307, May 1996.

L. P. B. Katehi, J. F. Harvey, and E. M. Tentzeris,

“Time-domain analysis using multiresolution

expansions,” in Advances in Computational

Electromagnetics, A. Taflove, Ed., Boston, Artech

House, 1998.

Dec and K. Suyama, “Micromachined electro-

mechanically tunable capacitors and their Applications to

RF IC’s,” IEEE Trans. Microwave Theory Tech., vol. 46,

no. 12, pp.2587-2596, Dec.1998.

E. M. Tentzeris, “Computational optimization of MRTD

Haar-based adaptive schemes used for the design of RF

packaging structures,” Proc. 16th Annual Review of

Progress in Applied Computational Electromagnetics,

pp.548-555, March 2000, Monterey, CA.

N. Bushyager, B, McGarvey, M. M. Tentzeris, “Adaptive

numerical modeling of RF structures requiring the

coupling of Maxwell’s, mechanical, and solid-state

equations,” accepted to Proc. 17th Annual Review of

Progress in Applied Computational Electromagnetics,

March 2001, Monterey CA.

A.Taflove and S. Hagness, Computational

Electrodynamics, the finite difference time domain

approach, 2nd ed., Boston, Artech House, 2000.

E.Tentzeris, R.Robertson, A.Cangellaris and

L.P.B.Katehi, ”Space- and Time- Adaptive Gridding

Using MRTD”, Proc. of the 1997 IEEE Symposium on

Microwave Theory and Techniques (IMS1997), pp.337-

,Denver,CO.

W. Boyce and R. DiPrima, Elementary Differential

Equations and Boundary Value Problems, 6 th ed., New

York, J. Wiley and Sons, 1997.

H.-P.Tsai, R.Coccioli and T.Itoh, “Time Domain Global

Modeling of EM Propagation in Semiconductor Using

Irregular Grids”, Proc. of the 2000 IEEE Symposium on

Microwave Theory and Techniques (IMS 2000), pp.367-

, Boston, MA.

S.M.S. Imtiaz and S.M.El-Ghazaly, “Global Modeling of

mm-wave circuits: EM simulation of amplifiers”, IEEE

Trans. Microwave Theory Tech., vol.45,no.12,pp.2208-

,Dec.1997.

S.Goasguen and S.M.El-Ghazaly, “Interpolating Wavelet

Scheme Toward Global Modeling of microwave

Circuits”, Proc. of the 2000 IEEE Symposium on

Microwave Theory and Techniques (IMS 2000), pp. 375-

, Boston, MA.

C.Sarris and L.P.B.Katehi, “Multiresolution Time

Domain (MRTD) Schemes with Space-Time Haar

Wavelets", Proc. of the1999 IEEE Symposium on

Microwave Theory and Techniques (IMS 1999), pp.

-1462, Anaheim, CA

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Published

2022-07-09

How to Cite

[1]
N. . Bushyager, B. . McGarvey, and E. M. . Tentzeris, “Introduction of an Adaptive Modeling Technique for the Simulation of RF Structures Requiring the Coupling of Maxwell’s, Mechanical, and Solid-State Equations”, ACES Journal, vol. 17, no. 1, pp. 104–111, Jul. 2022.

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