Design of DC to 40 GHz GaAs-based MMIC Attenuators by Utilizing Full-chip Numerical Analyses

Authors

  • Mehmet Emin Bayrak Department of Electrical and Electronics Engineering Istanbul Medipol University, Istanbul, 34810, Turkey
  • Harun Tekin Department of Electrical and Electronics Engineering Istanbul Medipol University, Istanbul, 34810, Turkey
  • Huseyin Serif Savci Department of Electrical and Electronics Engineering Istanbul Medipol University, Istanbul, 34810, Turkey https://orcid.org/0000-0002-5881-1557

DOI:

https://doi.org/10.13052/2024.ACES.J.390710

Keywords:

Finite element method, GaAs integrated passive device, Method of Moments, monolithic microwave integrated circuit, wideband attenuator

Abstract

In this study, a numerical analysis-based design methodology of monolithic microwave integrated circuit (MMIC) attenuators on a GaAs-based microwave integrated passive device (IPD) technology is presented. The designs have 0 dB, 3 dB, 4 dB, 6 dB, 10 dB, 12 dB, 20 dB, and 30 dB attenuation from DC to 40 GHz. The attenuators are designed for a maximum RF power of 26 dBm and a maximum die area of 0.25 mm2. The circuits are physically compact but electrically large. The finite element method and Method of Moments (MoM)-based analyses are used. The MoM-based solutions show close correlations with the measurements. The measured return losses are better than 20 dB, and insertion loss variation is less than 0.5 dB across the entire band. This paper explains the detailed design steps and numerical electromagnetic setup to achieve first-pass success.

Downloads

Download data is not yet available.

Author Biographies

Mehmet Emin Bayrak, Department of Electrical and Electronics Engineering Istanbul Medipol University, Istanbul, 34810, Turkey

Mehmet Emin Bayrak received his B.S. degrees in both Biomedical Engineering and Electrical & Electronics Engineering as double major in 2019 and 2020, respectively. He graduated with M.S. degree from Electrical Electronics Engineering and Cyber Systems program at Istanbul Medipol University in 2022. His master’s thesis was on passive MMIC devices. Since 2021, he has been working at TUBITAK, BILGEM as a Researcher. His research interests are III-V-based active and passive MMIC design.

Harun Tekin, Department of Electrical and Electronics Engineering Istanbul Medipol University, Istanbul, 34810, Turkey

Harun Tekin was born in Istanbul, Turkey, in 1997. He received his B.S. in Electrical & Electronics Engineering from Istanbul Medipol University, Istanbul, Turkey, in 2020. He is currently pursuing an M.S. student in the Electrical Electronics Engineering and Cyber Systems program at Istanbul Medipol University. Since 2022, he has been working as an RF Hardware Design Engineer at NETA Communications. His research topics are the design of passive MMIC, antennas, receiver, and transmitter systems.

Huseyin Serif Savci, Department of Electrical and Electronics Engineering Istanbul Medipol University, Istanbul, 34810, Turkey

Huseyin Serif Savci received the B.S. in Electronics & Communication Engineering from Yildiz Technical University, Istanbul, Turkey in 2001 and the M.S. and Ph.D. degrees in Electrical Engineering from Syracuse University, Syracuse, NY, USA, in 2005 and 2008, respectively. From 2008 to 2013, he was with Skyworks Solutions Inc., Cedar Rapids, IA, USA, as a Senior RFIC Design Engineer. Between 2013 and 2020, he worked as a Principal Design Engineer for Hittite Microwave Corporation, Chelmsford, Massachusetts, and Analog Devices Inc., Istanbul, Turkey. Over the years, he designed and released many RFIC and MMIC products on CMOS, SiGe, SOI, GaN, and GaAs technologies. He is currently an Associate Professor in the Department of Electrical and Electronics Engineering at Istanbul Medipol University, Istanbul, Turkey. He leads the RFMicroSense Research Group, which focuses on the design and modeling of RF and Microwave Integrated Circuits, devices, systems, and antennas. He is also an Associate Editor for the Applied Computational Electromagnetics Society.

References

J.-W. Jung, K.-K. Nae, J.-H. Bae, E.-J. Lee, H.-R. Oh, Y.-R. Seong, and J. Park, “Compact size directional coupler for mobile RFID reader,” in 2007 IEEE/MTT-S International Microwave Symposium, Honolulu, HI, pp. 987-989, 2007.

S. Li, L. Ma, L. Wang, B. Wu, Y. Cheng, X. Lei, F. Liu, and G. J. Cheng, “An ultrawideband GaAs MMIC microstrip directional coupler with high directivity and very flat coupling,” IEEE Transactions on Microwave Theory and Techniques, vol. 70, no. 4, pp. 2271-2279, Apr. 2022.

S. Hu and G. Qian, “Design of a miniature X-band broadband unequal power divider MMIC using bridged-T coils,” in 2021 International Applied Computational Electromagnetics Society (ACES-China) Symposium, Chengdu, China, pp. 1-2, 2021.

Y. Chen, X. Yan, H. Wu, and L. Sun, “The design and miniaturization of 6-15 GHz lumped-element Wilkinson power divider based on GaAs IPD technology,” in 2018 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Chengdu, China, pp. 207-210, 2018.

K.-Y. Chen, B.-X. Fang, and H.-H. Yeh, “IPD broadband balun design for GSM applications,” in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium, Singapore, pp. 1-4, 2010.

Y. Lu, L. Shen, J. Wang, and Y. Shen, “The design of miniaturized broadband power divider utilizing GaAs-based IPD process and equivalent circuit model,” Chinese Institute of Electronics Journal of Semiconductors, vol. 38, no. 8, Aug. 2017.

E. S. Kim, Y. Li, Z. Yao, and N. Y. Kim, “A compact Wilkinson power divider with high performance by GaAs-based optimized IPD process,” International Journal of Engineering and Technical Research, vol. 2, no. 10, Oct. 2014.

X. Mi, T. Takahashi, and S. Ueda, “Integrated passives on LTCC for achieving chip-sized-modules,” in 2008 38th European Microwave Conference, Amsterdam, Netherlands, pp. 607-610, 2008.

Y. Y. Zhu, Y.-J. Yang, and J.-X. Chen, “High performance bandpass filter using HTCC stepped-impedance resonators,” IET Microwaves, Antennas & Propagation, vol. 12, no. 1, pp. 56-62, Jan. 2018.

P. Kuzhir, A. Paddubskaya, N. Valynets, K. Batrakov, T. Kaplas, P. Lamberti, R. Kotilkova, and P. Lambin, “Main principles of passive devices based on graphene and carbon films in microwave—THz frequency range,” Journal of Nanophotonics, vol. 11, no. 3, p. 032504, July 2017.

K. Byun, Y. Ju Park, J.-H. Ahn, and B.-W. Min, “Flexible graphene-based microwave attenuators,” Nanotechnology, vol. 26 no. 5, p. 055201, Feb. 2015.

K.-H. Lee, E.-S. Kim, J.-G. Liang, and N.-Y. Kim, “Design and realization of a compact high-frequency band-pass filter with low insertion loss based on a combination of a circular-shaped spiral inductor, spiral capacitor and interdigital capacitor,” Electronics, vol. 7, no. 9, p. 195, Sep. 2018.

G. Shen, W. Che, W. Feng, Y. Shi, and Y. Shen, “Low insertion-loss MMIC bandpass filter using lumped-distributed parameters for 5G millimeter-wave application,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 1, pp. 98-108, Jan. 2021.

C.-Y. Hsiao, Y.-C. Huang, and T.-L. Wu, “An ultra-compact common-mode bandstop filter with modified-T circuits in Integrated Passive Device (IPD) process,” IEEE Transactions on Microwave Theory and Techniques, vol. 63, no. 11, pp. 3624-3631, Nov. 2015.

K. W. Wong, R. R. Mansour, and G. Weale, “Reconfigurable bandstop and bandpass filters with wideband balun using IPD Technology for frequency agile applications,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 4, pp. 610-620, Apr.2017.

B. Lefebvre, A. Bessemoulin, H. Amara, R. Sevin, and P. Quentin, “High dynamic range, triple gate-based compact DC-40 GHz variable attenuator MMIC for Ka-band variable gain amplifier ICs,” in 25th Annual Technical Digest 2003. IEEE Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, San Diego, CA, pp. 135-138, 2003.

B. Khabbaz, A. Pospishil, E. R. Schineller, H. P. Singh, and J. Jorgenson, “DC-20 GHz MMIC multi-bit digital attenuators with on-chip TTL control,” in GaAs IC Symposium Technical Digest, Monterey, CA, pp. 239-242, 1991.

R. Teja N. P. Verma, A. Kumar, and A. N. Bhattacharya, “A broadband high linearity voltage variable attenuator MMIC,” in 2015 6th International Conference on Computers and Devices for Communication (CODEC), Kolkata, India, pp. 1-4,2015.

D. Hao, W. Zhang, X. Liu, and Y. Liu, “A wideband 6-bit digital attenuator in a GaAs pHEMT MMIC,” Electronics, vol. 11, no. 14, p. 2166, July 2022.

R. Gupta, L. Holdeman, H. Carlson, J. Potukuchi, K. Hogan, and K. Pande, “Manufacturing technology and yield studies for MMIC 5-bit digital attenuators and phase-shifters,” in 12th Annual Symposium on Gallium Arsenide Integrated Circuit (GaAs IC), New Orleans, LA, pp. 305-308, 1990.

G. Lizama, T. Andrade, and R. Benton, “1-6 GHz GaAs MMIC linear attenuator with integral drivers,” in Microwave and Millimeter-Wave Monolithic Circuits, Dallas, TX, pp. 105-107, 1987.

H. Kondoh, “DC-50 GHz MMIC variable attenuator with a 30 dB dynamic range,” in IEEE MTT-S International Microwave Symposium Digest, New York, NY, pp. 499-502, 1988.

Y. Tajima, T. Tsukii, R. Mozzi, E. Tong, L. Hanes, and B. Wrona, “GaAs monolithic wideband (2-18 GHz) variable attenuators,” in MTT-S International Microwave Symposium Digest, Dallas, TX, pp. 479-481, 1982.

B. Maoz, “A novel, linear voltage variable MMIC attenuator,” IEEE Transactions on Microwave Theory and Techniques, vol. 38, no. 11, pp. 1675–1683, Nov. 1990.

A. Aksen, E. G. Çimen, and B. S. Yarman, “A numerical real frequency broadband matching technique based on parametric representation of scattering parameters,” in IEEE APCCAS’98, Asia Pacific Conference on Circuits and Systems, Chiangmai, Thailand, pp. 351-354, 1998.

B. S. Yarman and A. Fettweis, “Computer-aided double matching via parametric representation of Brune functions,” IEEE Transactions on Circuits and Systems, vol. 37, no. 2, pp. 212-222, Feb.1990.

J. Lim, D. Kwon, J.-S. Rieh, S.-W. Kim, and S. W. Hwang, “RF characterization and modeling of various wire bond transitions,” IEEE Transactions on Advanced Packaging, vol. 28, no. 4, pp. 772-778, Nov. 2005.

A. Sadigh, K. Kottapalli, and P. Petre, “EM simulation of packaged MMIC and microstrip antennas using ‘Microwave Explorer’,” ACES Journal, vol. 10, no. 3, pp. 146–152, Mar. 1995.

A. S. Zagorodny, N. N. Voronin, I. V. Yunusov, G. G. Goshin, A. V. Fateev, and A. Y. Popkov, “Microwave microstrip attenuators for GaAs monolithic integrated circuits,” in International Conference and Seminar of Young Specialists on Micro/ Nanotechnologies and Electron Devices, Altai, Russia, pp. 67-71, 2012.

L. Dong, Y. Huang and X. Chen, “Novel silicon-based attenuator chip,” in IEEE 4th International Conference on Electronics and Communication Engineering (ICECE), Xi’an, China, pp. 324-329, 2021.

Q. Zhong, X. Liang, and Z. Liu, “Design of single thin film resistor network as 20dB attenuator for DC-20GHz application,” in 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, China, pp. 297-300, 2015.

H. J. Finlay, L. G. T. Hopkins, and J. M. Ozamiz, “Design and applications of precision microstrip multioctave attenuators and loads,” in 6th European Microwave Conference, Rome, Italy, pp. 692-696, 1976.

Downloads

Published

2024-07-31

How to Cite

[1]
M. E. . Bayrak, H. . Tekin, and H. S. . Savci, “Design of DC to 40 GHz GaAs-based MMIC Attenuators by Utilizing Full-chip Numerical Analyses”, ACES Journal, vol. 39, no. 07, pp. 658–667, Jul. 2024.