De-embedding Technique for Extraction and Analysis of Insulator Properties in Cables
DOI:
https://doi.org/10.13052/2024.ACES.J.400608Keywords:
Cable, characterization, de-embedding, dielectric constant, Nicolson-Ross-Weir (NRW) methodAbstract
This work utilizes the Nicolson-Ross-Weir (NRW) method to analyze the frequency-dependent material properties of the insulator inside cables. These properties include ε(f), μ(f), and tanδ. Common methods for this analysis include the open-ended coaxial probe method, free space method, resonant method, and transmission/reflection line method. Each method has a suitable structure and may require additional samples for measurement. Our proposed method can calculate the real material properties of the insulation after foaming in the cable following extrusion, up to 40 GHz. This study also compiles the effects of various factors on the extraction of material parameters and provides a detailed analysis of potential sources of error. We observed that variations in production can introduce discrepancies after de-embedding, which can result in anomalies at the dissipation factor curve. Finally, we propose a correction method that effectively improves the accuracy of the extracted dielectric constant.
Downloads
References
IEEE Standard for Ethernet Amendment 2: Physical Layer Specifications and Management Parameters for 100 GB/s Operation Over Backplanes and Copper Cables, IEEE Std 802.3bj-2014 (Amendment to IEEE Std 802.3-2012 as amended by IEEE Std 802.3bk-2013), pp. 1-368, 3 Sep. 2014.
E. Mayevskiy and H. James, “Limitations of the intra-pair skew measurements in gigabit range interconnects,” DesignCon, 2016.
Z. Chen, M. Prasad, D. O’Connor, P. Bond, and A. Muszynski, “Differential TwinAx cable modeling by measured 4-port S-parameters,” in Proc. IEEE 14th Topical Meeting Elect. Perform. Electron. Package, pp. 87-90, 2005.
Y. Shlepnev and C. Nwachukwu, “Modelling jitter induced by fibre weave effect in PCB dielectrics,” Proc. IEEE Int. Symp. Electromagnet. Compat., pp. 803-808, 2014.
E. J. Denlinger, “Frequency dependence of a coupled pair of microstrip lines (correspondence),” IEEE Trans. Microwave Theory Tech., vol. 18, no. 10, pp. 731-733, Oct. 1970.
Y. Liu, S. Bai, C. Li, V. S. De Moura, B. Chen, and S. Venkataraman, “Inhomogeneous dielectric induced skew modeling of TwinAx cables,” IEEE Transactions on Signal and Power Integrity, vol. 2, pp. 94-102, 2023.
A. Talebzadeh, K. Koo, P. K. Vuppunutala, J. Nadolny, A. Li, and Q. Liu “SI and EMI performance comparison of standard QSFP and flyover QSFP connectors for 56+ GBps applications,” Proc. IEEE Int. Symp. Electromagnet. Compat. Signal/Power Integrity, pp. 776-781, 2017.
W. H. Tsai, D. B. Lin, T. F. Tseng, and C. H. Ho, “Analysis of electrical characteristics of TwinAx cable with asymmetric structures,” in 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electro-magnetic Compatibility (EMC Japan /APEMC Okinawa), Ginowan, Okinawa, Japan, pp. 342-345, 2024.
R. Joshi, S. K. Podilchak, C. Constantinides, and B. Low, “Flexible textile-based coaxial transmission lines for wearable applications,” IEEE Journal of Microwaves, vol. 3, no. 2, pp. 665-675, Apr.2023.
A. Lago, C. M. Penalver, J. Marcos, J. D. Gandoy, A. A. N. Melendez, and O. Lopez, “Electrical design automation of a twisted pair to optimize the manufacturing process,” IEEE Trans. on Components, Packaging and Manufacturing Technology, vol. 1, no. 8, pp. 1269-1281, Aug. 2011.
Telephone cable. Test methods, Moscow: Standards Publishing House, GOST (State Standard) 27893-88, 1989.
S. Yasufuku, T. Umemura, and Y. Ishioka, “Phenyl methyl silicone fluid and its application to high-voltage stationary apparatus,” IEEE Transactions on Electrical Insulation, vol. EI-12, no. 6, pp. 402-410, Dec. 1977.
R. M. Hakim, R. G. Olivier, and H. St-Onge, “The dielectric properties of silicone fluids,” IEEE Transactions on Electrical Insulation, vol. EI-12, no. 5, pp. 360-370, Oct. 1977.
Cables, wires and cords. Methods of voltage testing, Moscow: Standards Publishing House, GOST (State Standard) 2990-72, 1986.
A. Goldshtein, G. Vavilova, and S. Mazikov, “Capacitance control on the wire production line,” IME&T, 2016.
I. Dilman, M. N. Akinci, T. Yilmaz, M. Çayören, and I. Akduman, “A method to measure complex dielectric permittivity with open-ended coaxial probes,” IEEE Transactions on Instrumentation and Measurement, vol. 71, pp. 1-7, 2022.
D. Popovic, L. McCartney, C. Beasley, M. Lazebnik, M. Okoniewski, and S. C. Hagness, “Precision open-ended coaxial probes for in vivo and ex vivo dielectric spectroscopy of biological tissues at microwave frequencies,” IEEE Transactions on Microwave Theory and Techniques, vol. 53, no. 5, pp. 1713-1722, May 2005.
M. J. Da Silva, E. Schleicher, and U. Hampel, “A novel needle probe based on high-speed complex permittivity measurements for investigation of dynamic fluid flows,” IEEE Trans. on Instrumentation and Measurement, vol. 56, no. 4, pp. 1249-1256, Aug. 2007.
H. Shwaykani, J. Costantine, A. El-Hajj, and M. Al-Husseini, “Monostatic free-space method for relative permittivity determination using horn antenna near-field measurements,” IEEE Antennas and Wireless Propagation Letters, vol. 23, no. 4, pp. 1336-1340, Apr. 2024.
B. Moon and J. Oh, “FSS-enhanced quasi-optical dielectric measurement method for liquid crystals in sub-THz band,” IEEE Antennas and Wireless Propagation Letters, vol. 22, no. 12, pp. 3062-3066, Dec. 2023.
L. S. Rocha, C. C. Junqueira, E. Gambin, A. N. Vicente, A. E. Culhaoglu, and E. Kemptner, “A free space measurement approach for dielectric material characterization,” in 2013 SBMO/IEEE MTT-S International Microwave & Optoelectronics Conference (IMOC), Rio de Janeiro, Brazil,2013.
J.-M. Heinola, P. Silventoinen, K. Latti, M. Kettunen, and J.-P. Strom, “Determination of dielectric constant and dissipation factor of a printed circuit board material using a microstrip ring resonator structure,” in 15th International Conference on Microwaves, Radar and Wireless Communications (IEEE Cat. No.04EX824), Warsaw, Poland, vol. 1, pp. 202-205, 2004.
G. Galindo-Romera, F. Javier Herraiz-Martínez, M. Gil, J. J. Martínez-Martínez, and D. Segovia-Vargas, “Submersible printed split-ring resonator-based sensor for thin-film detection and permittivity characterization,” IEEE Sensors Journal, vol. 16, no. 10, pp. 3587-3596, May 2016.
H. Shwaykani, A. El-Hajj, J. Costantine, F. A. Asadallah, and M. Al-Husseini, “Dielectric spectroscopy for planar materials using guided and unguided electromagnetic waves,” in 2018 IEEE Middle East and North Africa Communications Conference (MENACOMM), Jounieh, Lebanon, pp. 1-5, 2018.
H. B. Wang and Y. J. Cheng, “Broadband printed-circuit-board characterization using multimode substrate-integrated-waveguide resonator,” IEEE Transactions on Microwave Theory and Techniques, vol. 65, no. 6, pp. 2145-2152, June 2017.
W. B. Weir, “Automatic measurement of complex dielectric constant and permeability at microwave frequencies,” Proceedings of the IEEE, vol. 62, no. 1, pp. 33-36, Jan. 1974.
B. Chen, X. Ye, B. Samaras, and J. Fan, “A novel de-embedding method suitable for transmission-line measurement,” in 2015 IEEE APEMC, Taipei, Taiwan, 2015.
Y.-C. Luo, Y.-H. Chen, C.-Y. Zhuang, J.-H. Lu, and D.-B. Lin, “The bandwidth limitation of de-embedding technique for microstrip line measurement,” in 2023 VTS Asia Pacific Wireless Communications Symposium (APWCS), Tainan City, Taiwan, 2023.
IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz, IEEE Std 370-2020, pp. 1-147, 8 Jan. 2021
B. Hofmann and S. Kolb, “A multi standard method of network analyzer self-calibration-generalization of multiline TRL,” IEEE Transactions on Microwave Theory and Techniques, vol. 66, no. 1, pp. 245-254, Jan. 2018.
C. Yang and H. Huang, “Extraction of stable complex permittivity and permeability of low-loss materials from transmission/reflection measurements,” IEEE Transactions on Instrumentation and Measurement, vol. 70, pp. 1-8, 2021.


