Interference Effects of Via Interconnect in Three Layer Printed Circuit Board
Keywords:
Crosstalk, electromagnetic compatibility, PCB, transmission line, via, via inductanceAbstract
Cylindrical vias are commonly used for interconnection in multilayered Printed Circuit Board (PCB) design. The RF current through vias causes radiated interference to adjacent traces. This paper describes an analytical method of computing the radiation from cylindrical via using the electromagnetic theory. Three layer printed circuit board consisting of three traces on the top of a dielectric substrate, a middle orthogonal trace and a ground plane at the bottom, is considered. The RF voltage coupling at the terminations of the traces due to the near field radiation from the via is computed. The reactive couplings between the traces are determined from the parasitic elements using transmission line equations. The total coupling obtained from analytical method is compared with those of modeling and simulation with Ansoft HFSS software tool. The total crosstalk is also measured using an available Network Analyzer. A good agreement is found. The changes of radiated coupling with the change of position of via, trace separation and trace length are also investigated. This paper shows that the analytical method is a useful tool for predicting interference in PCB without using expensive simulation software.
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References
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