A Broadband Microstrip-to-Microstrip Vertical Via Interconnection for Low Temperature Co-Fired Ceramic Applications
Keywords:
Equivalent model, low temperature cofired ceramic, microstrip-to-microstrip and vertical via interconnect, microwaveAbstract
This letter presents a microstrip-to-microstrip vertical via interconnect in microwave low temperature co-fired ceramic (LTCC) technology. According to the simulation results, the insertion loss is less than 0.33 dB and the return loss is greater than 29.9 dB from 0.3 GHz to 18 GHz. An equivalent lumped model is developed for analyzing the microstrip-to-microstrip vertical interconnection. The structure has been manufactured and measured.
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References
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