LTCC Wideband Bandpass Filter Based on Multi-layered Coupling
Keywords:
Bandpass filter, LTCC, multi-layered coupling, open/short coupled lines, widebandAbstract
A novel wideband bandpass filter (BPF) based on multi-layered coupling using low temperature co-fired ceramic (LTCC) technology is proposed. Four folded quarter-wavelength layered coupled lines are distributed in 3D space to achieve compact circuit structure. Two transmission zeros near edges of the passband response can be easily realized by the two quarter-wavelength open/short coupled lines. Besides over 15-dB out-of-band rejection, the insertion loss of less than 0.7 dB is realized in the passband. A prototype with 3-dB fractional bandwidth of 25.7% operated at 2.95 GHz is designed and fabricated.
Downloads
References
L. K. Yeung and K.-L. Wu, “A compact secondorder LTCC bandpass filter with two finite transmission zeros,” IEEE Trans. Microw. Theory Techn., vol. 51, no. 2, pp. 337-341, Feb. 2003.
W. Tung, Y. Chiang, and J. Cheng, “A new compact LTCC bandpass filter using negative coupling,” IEEE Microw. Wireless Compon. Lett., vol. 15, no. 10, pp. 641-643, Oct. 2005.
C. W. Tang and D. L. Yang, “Realization of multilayered wide- passband bandpass filter with low-temperature co-fired ceramic technology,” IEEE Trans. Microw. Theory Techn., vol. 56, no. 7, pp. 1668-1674, July 2008.
Y.-H. Jeng, S. F. R. Chang, and H.-K. Lin, “A high stopband-rejection LTCC filter with multiple transmission zeros,” IEEE Trans. Microw. Theory Techn., vol.54, no. 2, pp. 633-638, Feb. 2006.
K. W. Qian and X. H. Tang, “Design of LTCC wideband bandpass filter using semilumped resonators,” Electron. Lett., vol. 47, no. 12, pp. 704-705, June 2011.
X. Y. Zhang, X. Dai, H. L. Kao, B. H. Wei, Z. Y. Cai, and Q. Xue, “Compact LTCC bandpass filter with wide stopband using discriminating coupling,” IEEE Trans. Compon., Packag., Manuf. Technol, vol. 4, no. 4, pp. 656-663, Apr. 2014.
J. X. Chen, Y. Zhan, and Q. Xue, “Novel LTCC distributed-element wideband bandpass filter based on the dual-mode stepped-impedance resonator,” IEEE Trans. Compon., Packag., Manuf. Technol, vol. 5, no. 3, pp. 372-380, Mar. 2015.
