Thermomechanical analysis of oscillatory pin-bushing performance

Authors

  • Rajesh Krithivasan Product Engineer (R&D), Dresser Inc. LA Highway 3225 @ US-167N Alexandria, LA-71309, United States of America
  • Michael M. Khonsari Dow Chemical Endowed Chair and Professor Department of Mechanical Engineering, Louisiana State University Baton Rouge, LA-70803, United States of America

Keywords:

thermally induced seizure, scuffing, oscillating pin-bushing, earthmoving equipment

Abstract

This paper presents a Finite Element Analysis (FEA) to effectively describe the thermomechanical interactions of a heavily loaded oscillating pin-bushing pair used in earthmoving equipment. An objective of this analysis is to predict the time to failure when a pin-bushing pair is subjected to heavy loads and to improve performance and increase the Mean Time between Failures (MTBF). FEA results reveal that two types of failure can take place depending on different operating parameters. They are: (i) Thermally Induced Seizure and (ii) Scuffing. An extensive set of parametric simulations covering load, speed, shaft radius, operating clearance, bearing length, friction coefficient and thermal expansion coefficient are performed to gain insight into the failure of oscillating pin-bushings. A statistical procedure is applied to the simulated results and an empirical relationship is derived.

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Published

2005-06-06

How to Cite

Krithivasan, R., & Khonsari, M. M. (2005). Thermomechanical analysis of oscillatory pin-bushing performance. European Journal of Computational Mechanics, 14(2-3), 255–269. Retrieved from https://journals.riverpublishers.com/index.php/EJCM/article/view/2235

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Original Article