Broad-band Characterization of Wire Interconnects Using a Surface Integral Formulation with a Surface Effective Impedance
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Broad-band Characterization of Wire Interconnects Using a Surface Integral Formulation with a Surface Effective ImpedanceAbstract
A surface integral formulation is used for a broad-band characterization of wire interconnects. A suitable definition of effective impedance accounts for the penetration of currents and charges inside lossy conductors. The results are successfully compared to a volumetric integral approach.
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