A Novel Zigzag Line-based EBG Structure for the Simultaneous Switching Noise Suppression
Keywords:
Coplanar electromagnetic band-gap, electromagnetic band-gap structure, high-speed digital circuits, simultaneous switching noiseAbstract
Simultaneous switching noise (SSN) generated between the power supply and the ground plane of a high-speed digital circuit is considered to be one of the most important factors affecting the signal integrity of a circuit system. In order to suppress the simultaneous switching noise, a new coplanar electromagnetic band-gap structure is proposed in this paper. Based on the zigzag line and square patch bridge, the inductance between the neighboring units can be enhanced. The results showed that the bandwidth of the band-gap is 0.1 ~ 12.6GHz when the depth of the new electromagnetic band-gap (EBG) structure is -30 db. Compared to the same parameter of the L-bridge structure, the relative bandwidth is about 48.7% and the cut-off frequency of the stop-band lower limit is reduced by 600MHz. The simultaneous switching noise on the power supply plane can be suppressed in all directions, and the signal integrity is less affected when the signal is transmitted by the differential line.
Downloads
References
G. H. Shiue, J. H. Shiu, Y. C. Tsai, et al., “Analysis of common-mode noise for weakly coupled differential serpentine delay microstrip line in high-speed digital circuits,” IEEE T. Electromagn. C, vol. 54, pp. 655-666, June 2012.
N. A. Azmi, R. C. Ismail, S. S. Jamuar, et al., “Design of DC high voltage and low current power supply using Cockroft-Walton (C-W) voltage multi-plier,” 2016 3rd International Conference on Electronic Design (ICED), Phuket, Thailand, Aug. 11-12, 2016.
M. S. Zhang, H. Z. Tan, and J. F. Mao, “Signalintegrity optimization for complicated multipleinput multiple-output networks based on data mining of S-parameters,” IEEE T. on Components, Packaging and Manufacturing Technology C, vol. 4 , pp. 1184-1192, Mar. 2014.
B. Ravelo, A. Thakur, A. Saini, and P. Thakur, “Microstrip dielectric substrate material characterization with temperature effect,” Applied Computational Electromagnetics Society Journal, vol. 30, pp. 1322-1328, Dec. 2015.
D. Atanu and S. A Simon, “Electromagnetic interference simulations for wide-bandgap power electronic modules,” IEEE Journal of Emerging and Selected Topics in Power Electronics C, vol. 4, pp. 757-766, May 2016.
M. M. Bait-Suailam and O. M. Ramahi, “Ultrawideband mitigation of simultaneous switching noise and EMI reduction in high-speed PCBs using complementary split-ring resonators,” IEEE T. Electromagn. C., vol. 54, pp. 389-396, Apr. 2012.
M. A. Alshargabi, Z. Z. Abidin, and M. Z. M. Jenu, “High speed PCB & spiral with patch EBG planar integration for EMI reduction,” 2015 International Conference on Computer, Communications, and Control Technology (I4CT), Kuching, Malaysia, Apr. 21-23, 2015.
S. Manshari, F. Hodjat Kashani, and Gh. Moradi, “Mutual coupling reduction in CBS antenna arrays by utilizing tuned EM-EBG and non-planar ground plane,” Applied Computational Electromagnetics Society Journal, vol. 31, pp. 750-755, July 2016.
X. M Wang, Y. Q Zhou, H. H, Peng, et al., “Onekey test system for relay protection equipment of intelligent substation,” Electric Power Automation Equipment C, vol. 33, pp. 155-159, Mar. 2013.
M. Zhang, J. Mao, and Y. Long, “Power noise suppression using power-and-ground via pairs in multilayered printed circuit boards,” IEEE T. Adv. Packaging C, vol. 1, pp. 374-385, Mar. 2011.
S. K. Mahto, A. Choubey, and R. Kumar, “A novel compact multi-band double Y-slot microstrip antenna using EBG structure,” 2015 International Conference on Microwave and Photonics (ICMAP), Dhanbad, India, Dec. 11-13, 2015.
L. F Shi, G. Zhang, M. M. Jin, et al., “Novel subregional embedded electromagnetic bandgap structure for SSN suppression,” IEEE Transactions on Advanced Packaging and Manufacturing Technology C, vol. 6, pp. 613-621, Mar. 2016.
