Design of a Broadband Microstrip-to-Microstrip Vertical Transition

作者

  • Ziwen Tao Ministerial Key Laboratory of JGMT Nanjing University of Science and Technology, Nanjing 210094, China
  • Jianpeng Wang Ministerial Key Laboratory of JGMT Nanjing University of Science and Technology, Nanjing 210094, China
  • Yan Dou Ministerial Key Laboratory of JGMT Nanjing University of Science and Technology, Nanjing 210094, China

关键词:

Microstrip transition, multilayer circuits, slotlines, Stepped Impedance Resonator (SIR)

摘要

A broadband microstrip-to-microstrip vertical transition is presented in this paper. The proposed transition consists of two quarterwavelength microstrip stubs and a halfwavelength slotline Stepped Impedance Resonator (SIR) on the common ground plane. The low-impedance section of the microstrip stub is formed by three single arms connecting in parallel, while the high-impedance section of slotline SIR is formed by four single arms connecting in series. A sample transition is designed and measured. Experimental results indicate that over 143% bandwidth with better than 10 dB return loss and below 2 dB insertion loss can be achieved.

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参考

R. Valois, D. Baillargeat, S. Verdyme, M. Lahti, and T. Jaakola, “High performances of shielded LTCC vertical transitions from DC up to 50 GHz,” IEEE Trans. Microw. Theory Tech., vol. 53, no. 6, pp. 2026-2032, June 2005.

F. Casares-Miranda, C. Viereck, C. CamachoPenãlosa, and C. Caloz, “Vertical microstrip transition for multilayer microwave circuits with decoupled passive and active layers,” IEEE Microw. Wireless Compon. Lett., vol. 16, no. 7, pp. 401-403, July 2006.

L. Zhu and K. Wu, “Ultra broadband vertical transition for multilayer integrated circuits,” IEEE Microw. Guided Wave Lett., vol. 9, no. 11, pp. 453-455, November 1999.

M. Abbosh, “Ultra wideband vertical microstripmicrostrip transition,” IET Microw. Antennas Propag., vol. 1, no. 5, pp. 968-972, October 2007.

C. Chen, M. Tsai, and G. Alexopoulos, “Optimization of aperture transitions for multiport microstrip circuits,” IEEE Trans. Microw. Theory Tech., vol. 44, no. 12, pp. 2457-2465, December 1996.

X. B. Huang and K. L. Wu, “A broadband and vialess vertical microstrip-to-microstrip transition,” IEEE Trans. Microw. Theory Tech., vol. 60, no. 4, pp. 938-944, April 2012.

E. S. Li, J. Cheng, and C. Lai, “Designs for broadband microstrip vertical transitions using cavity couplers,” IEEE Trans. Microw. Theory Tech., vol. 54, no. 1, pp. 464-472, January 2006.

T. Swierczynski, D. McNamara, and M. Clenet, “Via-walled cavities as vertical transitions in multilayer millimeter-wave circuits,” IET Electron. Lett., vol. 39, no. 25, pp. 1829-1831, December 2003.

J. Chramiec, “Reactances of slotline short and open circuits on alumina substrate,” IEEE Trans. Microw. Theory Tech., vol. 37, no. 10, pp. 1638- 1641, October 1989.

P. Soltysiak and J. Chramiec, “Design of broadband transitions from microstrip to slotline,” IET Electronics Letters, vol. 30, no. 4, pp. 328- 329, February 1994.

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已出版

2021-09-03

栏目

General Submission