Ultra High-Resolution FDTD Modeling of a High-Performance VLSI Package for Identifying Resonances and Coupling
关键词:
Ultra High-Resolution FDTD Modeling of a High-Performance VLSI Package for Identifying Resonances and Coupling摘要
It is becoming increasingly important to computationally predict, study, and prevent electromagnetic compatibility (EMC) issues arising within and between ICs and other components comprising portable electronic devices. Here, we conduct a phenomenological study involving an ultra high-resolution, threedimensional finite-difference time-domain (FDTD) model of a sample IC package having over one billion grid cells. Specifically, we determine the resonances and coupling patterns arising within the highly complex IC package. The frequency range of interest extends from 100 MHz to 7 GHz. Results indicate that the arrangement and geometry of the separate power, ground, and signaling networks comprising the IC package greatly influences the electromagnetic behavior within different regions of the package.
##plugins.generic.usageStats.downloads##
参考
"Beyond the Call- Intel and Motorola Explore
New Possibilities for the Cell Phone
Platform," URL:
http://techresearch.intel.com/articles/Explorato
ry/1431.htm
"Intel's Portable Prototypes," PC Magazine,
URL:
http://www.pcmag.com/article2/0.2704.18846
,00.aspR. F. Harrington, Time-Harmonic
Electromagnetic Fields, McGraw-Hill, New
York, 1961.
"New Intel Portable PC concept at Computex
Paipei 2007," Coolestgadgets.com, URL:
gadgets.com/20070606/new-intel-portable-
pc-concept-atcomputex-taipei-2007
S. R. Sedore, Automated Digital Computer
Program for Determining Responses of
Electronic Circuits to Transient Nuclear
Radiation (SCEPTRE), AFWL TR 66-126,
Air Force Weapons Laboratory, 1967a.
F. Canavero, S. Grivet-Talocia, I. A. Maio,
and I. S. Stievano, “Linear and Nonlinear
Macromodels for System-Level Signal
Integrity and EMC Assessment,” IEICE
Trans. Commun.: Invited Paper, Special
section of 2004 International Symposium on
EMC, vol. E88-B, no. 8, pp. 3121-3126, Aug.
K. Srinivasan, “Multiscale EM and Circuit
Simulation using the Laguerre-FDTD Scheme
for Package-Aware Integrated-Circuit
Design,” Ph.D. dissertation, School of ECE,
Georgia Institute of Technology, Atlanta, GA,
K. S. Yee, "Numerical Solution of Initial
Boundary Value Problems Involving
Maxwell's Equations in Isotropic Media,"
IEEE Trans. Antennas Propagat., vol. AP-14,
issue 8, pp. 302-307, May 1966.
A. Taflove and S. C. Hagness, Computational
Electrodynamics: The Finite-Difference Time-
Domain Method, 3rd edition. Norwood, MA:
Artech House, 2005.
J. J. Simpson, B. Horine, and H. Heck, "Ultra
High-Resolution FDTD Modeling of an
Integrated Circuit Package for Characterizing
and Solving EMC Problems in Compact
Portable Electronic Devices," Proc. IEEE AP-
S Intern’t Symp. and USNC/URSI Nat '1 Radio
Science Meeting, San Diego, CA, July 2008.
J. J. Simpson, "FDTD Full-Maxwell's
Equations Modeling from Near-DC to Light,"
Proc. 24th Int'l Review of Progress in Applied
Computational Electromagnetics (ACES),
Niagara Falls, Canada, April 2008.
C. M. Ruiz, J. J. Simpson, B. Horine, and K.
Slattery, “Utra High-Resolution FDTD
Modeling of a High-Performance VLSI
Package,” IEEE AP-S International
Symposium and USNC/URSI National Radio
Science Meeting, Charleston, SC, June 2009.
RUIZ, SIMPSON: ULTRA HIGH-RESOLUTION FDTD MODELING OF VLSI PACKAGE FOR IDENTIFYING RESONANCES AND COUPLING
S. Ben Dia, M. Ramdani, and E. Sicard,
editors, Electromagnetic Compatibility of
Integrated Circuits – Techniques for Low
Emission and Susceptibility, Springer, 2006.
F. Xu and K. Wu, “Guided-Wave and
Leakage Characteristics of Substrate
Integrated Waveguide,” IEEE Trans. Microw.
Theory Tech., vol. 53, no. 1, pp. 66–73, Jan.
S. Shahparnia and O. M. Ramahi, “A Simple
and Effective Model for Electromagnetic
Bandgap Structures Embedded in Printed
Circuit Boards,” IEEE Microw. Wireless
Compon. Lett., vol. 15, no. 10, pp. 621–623,
Oct. 2005.
S. Shahparnia and O. M. Ramahi,
“Miniaturazed Electromagnetic Bandgap
Structures for Ultra-Wide Band Switching
Noise Mitigation in High-Speedprinted
Circuit Boards and Packages,” in Proc. 13th
Topical Meeting Electrical Performance
Electronic Packaging., pp. 211-214, Portland,
OR, Oct. 25-27, 2004.
C. Guiffaut and K. Mahdjoubi, “A Parallel
FDTD Algorithm Using the MPI Library,”
IEEE Antennas Propag. Mag., vol. 43, no. 2,
pp. 94–103, Apr. 2001.
M. Piket-May, A. Taflove, and J. Baron,
“FD-TD Modeling of Digital Signal
Propagation in 3-D Circuits with Passive and
Active Loads,” IEEE Trans. Microwave
Theory and Tech., vol. 42, no. 8, pp. 1514-
, Aug, 1994
