On the Crosstalks between a Pair of Transmission Lines in the Presence of a 3D Printed Electrifi Trace

Authors

  • Dipankar Mitra Department of Electrical and Computer Engineering, North Dakota State University, Fargo, ND, USA
  • Kazi Sadman Kabir Department of Electrical Engineering, South Dakota School of Mines & Technology, Rapid City, SD, USA
  • Jerika Clevelenad Department of Electrical and Computer Engineering, North Dakota State University, Fargo, ND, USA
  • Ryan Striker Department of Electrical and Computer Engineering, North Dakota State University, Fargo, ND, USA
  • Benjamin D. Braaten Department of Electrical and Computer Engineering, North Dakota State University, Fargo, ND, USA
  • Shengrong Ye Multi3D Inc., Cary, NC, USA
  • Sayan Roy Department of Electrical Engineering, South Dakota School of Mines & Technology, Rapid City, SD, USA

Keywords:

additive manufacturing, crosstalk, electrifi, EMC analysis, transmission lines

Abstract

The technology of additive manufacturing results in 3D printing of conductive traces in radio frequency circuits. This creates a plethora of possibilities in realizing flexible and wearable electronics. While the prototypes of microstrip transmission lines and antennas have been recently reported, there is now a need of Electromagnetic Compatibility based study of such 3D printed conductive traces. This paper presents a comparative study on the near end and far end unintentional crosstalk components between a pair of microstrip transmission lines made of Copper in the presence of a 3D printed conductive trace made of a commercially available conductive filament, Electrifi. Any physical contact with the 3D printed trace has been purposefully averted to discard the high contact resistance between the trace and such contacts.

Downloads

Download data is not yet available.

References

S. Roy, M. B. Qureshi, S. Asif, and B. D. Braaten, “A Model for 3D Printed Microstrip Transmission Lines using Conductive Electrifi Filament,” 2017 IEEE International Symposium on Antennas and Propagation, California, USA, July 9-14, 2017.

D. Mitra, R. Striker, B. D. Braaten, A. Aqueeb, K. S. Kabir, and S. Roy, “On the Design of An Improved Model of Additively Manufactured Microstrip Transmission Lines for Radio Frequency Applications,” 2019 IEEE International Conference on Electro Information Technology (EIT), Brookings, SD, USA, 2019, pp. 182-184.

F. Pizarro, R. Salazar, E. Rajo-Iglesias, M. Rodríguez, S. Fingerhuth, and G. Hermosilla, “Parametric study of 3D additive printing parameters using conductive filaments on microwave topologies,” in IEEE Access, vol. 7, pp. 106814-106823, 2019.

Multi3D. [online] Available: www.multi3dllc.com

Rogers Corporation [online] Available: www.rogerscorp.com

2016 Ansys Inc., Available: https://www.ansys.com

Downloads

Published

2020-11-07

How to Cite

[1]
Dipankar Mitra, “On the Crosstalks between a Pair of Transmission Lines in the Presence of a 3D Printed Electrifi Trace”, ACES Journal, vol. 35, no. 11, pp. 1286–1287, Nov. 2020.

Issue

2020: Vol 35 Iss 11

Section

Articles