Depot electrolytique epais : Modification du profil de Ia piece a revetir

Authors

  • Frederic Druesne centre Technique des Industries Micaniques (CETIM), Dipartement Calcul 52 avenue Felix Louat, BP80067, F-60304 Sen/is cedex and Universiti de Technologie de Compiegne, Dipartement Genie des Systemes Micaniques, Centre de recherches de Royallieu, BP20529, F-60205 Compiegne cedex
  • Pascal Paumell centre Technique des Industries Micaniques (CETIM), Dipartement Calcul 52 avenue Felix Louat, BP80067, F-60304 Sen/is cedex
  • Pierre Villon Universiti de Technologie de Compiegne, Dipartement Genie des Systemes Micaniques, Centre de recherches de Royallieu, BP20529, F-60205 Compiegne cedex

Keywords:

electrochemical plating, depositing thickness, polarisation laws, electrode growth, boundary element method

Abstract

A model of current distribution and cathodic electrode shape change for electrolytic deposit of about the millimetre has been developed. Potential distribution and current distribution on the part to cover depend on the geometry of this electrode. At different steps of the deposition, the geometric model of the cathodic profile must be redefined with the respect of the nodal normal. A double non-linearity must be resolved: material and geometry. At the sharp-edged where current lines are attracted the nodes displacement is realized in order to avoid to mesh again the cathodic surfaces.

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Published

1999-04-27

How to Cite

Druesne, F. ., Paumell, P. ., & Villon, P. (1999). Depot electrolytique epais : Modification du profil de Ia piece a revetir. European Journal of Computational Mechanics, 8(4), 471–485. Retrieved from https://journals.riverpublishers.com/index.php/EJCM/article/view/3009

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Original Article