Editorial Board Members

  • Ni An, AT&T, USA
  • Ahmed A. Abd El-Latif, Menoufia University, Egypt
  • Sateesh Addepalli, CISCO Systems, USA
  • Mahbubul Alam, Moviemento, USA
  • Mohammed. I. Alghamdi, Al-Baha University, Saudia Arabia
  • Soumya Banerjee, CNAM-CEDRIC LAB, INRIA-EVA, Paris, France
  • Krzysztof Cabaj, Warsaw University of Technology, Poland
  • Luca Caviglione, CNR - IMATI, Italy
  • Michal Choras, University of Technology and Life Sciences, Poland
  • Debabrata Das, IIIT Bangalore, India
  • Subir Das, Telcordia ATS, USA
  • Bela Genge, University of Tg. Mures, Romania
  • Zeno Geradts, Nederlands Forensisch Instituut, Netherlands
  • Brij B. Gupta, National Institute of Technology Kurukshetra, India
  • Pramod Jamkhedkar, Princeton University, USA
  • David Megías Jiménez, Universitat Oberta de Catalunya, Spain
  • Eduard Jorswieck, Dresden University of Technology, Germany
  • Joerg Keller, FernUniversitaet in Hagen, Germany
  • Maciej Korczynski, Grenoble Alpes University, France
  • Zbigniew Kotulski, Warsaw University of Technology, Poland
  • Geir Myrdahl Køien, South-Eastern Norway (USN), Norway
  • Minoru Kuribayashi, Okayama University, Japan
  • Ling Fei Lai, University of Arkansas at Little Rock, USA
  • Fuchun J. Lin, Telcordia, USA
  • Kenji Leibnitz, National Institute of Information and Communications Technology, Japan
  • Shujun Li, University of Kent, UK
  • Seshadri Mohan, University of Arkansas at Little Rock, USA
  • Aleksandra Mileva, University Goce Delcev, Republic of Macedonia
  • Ravi Krishnan Muthukrishnan, Visa Inc., USA
  • Debu Nayak, Huawei, India
  • Rasmus Hjorth Nielsen, Movimento, Denmark
  • Ramjee Prasad, Aarhus University, Denmark
  • Rajarshi Sanyal, Belgacom, Belgium
  • Remzi Seker, University of Arkansas at Little Rock, USA
  • Andreas U. Schmidt, Novalyst, Germany
  • K.P. Subbalakshmi, Stevens Institute of Technology, USA
  • Hui Tian, National Huaqiao University, China
  • Reza Tadayoni, Aalborg University, Denmark
  • Roman Tkachenko, Lviv Polytechnic National University, Ukraine
  • Simon Vrhovec, University of Maribor, Slovenia
  • Steffen Wendzel from Worms University of Applied Sciences, Germany
  • Wei Wei, Xi'an University of Technology, China
  • Sebastian Zander, Murdoch University, Australia