LCP Based Planar High Q Embedded Band Pass Filter for Wireless Applications
Keywords:
Embedded passives, High-Q, Polymer, Band Pass FilterAbstract
A novel miniaturized high-Q embedded passive polymer substrate based bandpass operating at LBand is offered.Alow profile, compact filter with high performance and high rejection out of band is presented. High Q passives such as inductors, capacitors and matching networks are embedded in the filter. It is easy to design. Embedded layers are integrated for 3D integration, parasitics are removed and interconnection losses are bargained by de embedding method. The filter is designed, simulated for Lband frequency for miniaturized mixed signal applications.
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El-Ghazaly, S.M. et al. (2001). Recent trends and enabling technologies
in RF and microwave applications. In IEEE Microwave Conference,
APMC 2001. 2001 Asia-Pacific (Vol. 3, pp. 978–983).
EVDO/EVDV. “http://ecee.colorado.edu/∼ecen4242/evdo/evdowebpa
ge.htm,” 24.Oct. 2010.
Tummala, R. R. (2006). Moore’s law meets its match (system-onpackage).
IEEE Spectrum, 43(6), 44–49.
Xinhai, B., Hongyan, G., Li, Z., Tan, K. H., and Lai, C. M. (2014).
Fabrication and measurement of BPF using IPD technology. In IEEE
Electronic Packaging Technology (ICEPT), 2014 15th International
Conference on (pp. 36–38).
Pinel, S., Davis, M., Sundaram, V., Lim, K., Laskar, J., White, G.,
and Tummala, R. (2003). High Q passives on Liquid Crystal Polymer
substrates and BGA technology for 3D integrated RF Front-End
Module. IEICE Transactions on Electronics, 86(8), 1584–1592.
Matsuzawa, A. (2002). RF-SoC-expectations and required conditions.
IEEE Transactions on Microwave Theory and Techniques, 50(1),
–253.
K. Lim, et al., (2002). “RF-SOP for wireless communications,” IEEE
Microwave Mag., vol. 3, pp. 88–99.
Thompson, D. C., Tantot, O., Jallageas, H., Ponchak, G. E., Tentzeris,
M. M., and Papapolymerou, J. (2004). Characterization of liquid crystal
polymer (LCP) material and transmission lines on LCP substrates from
to 110 GHz.IEEE Transactions on Microwave Theory and Techniques,
(4), 1343–1352.
Kutilainen, T., (2003). Ceramic interconnect initiative. nextGen 2003,
LTCC. [Online].Available: http://www.imaps.org/ cii/NextGen2003.pdf
Jayaraj, K., Noll, T. E., and Singh, D. R. (1995). “RF characterization
of a low cost multichip packaging technology for monolithic microwave
and millimeter wave integrated circuits,” in URSI Int. Signals, Systems,
and Electronics Symp., 443–446.
Culbertson, E. C. (1995).Anew laminate material for high performance
PCBs: Liquid crystal polymer copper clad films. In IEEE Electronic
Components and Technology Conference, 1995. Proceedings., 45th (pp.
–523).
Jayaraj, K., Noll, T. E., and Singh, D. R. (1995). A low cost multichip
packaging technology for monolithic microwave integrated circuits.
IEEE transactions on antennas and propagation, 43(9), 992–997.
Sarkar, S.,Wang,G., Tentzeris, M., et al., (2004). “RF and mm-wave SOP
module platform using LCP and RF MEMS technologies” Conference
Paper in IEEE MTT-S International Microwave Symposium digest.
Dalmia, S., Sundaram, V., White, G., & Swaminathan, M. (2004). Liquid
crystalline polymer (LCP) based lumped-element bandpass filters for
multiple wireless applications. In IEEE Microwave Symposium Digest,
IEEE MTT-S International (Vol. 3, pp. 1991–1994).
Dalmia, S., Sundaram, V., White, G., and Swaminathan, M. (2004).
Liquid crystalline polymer based RF/wireless components for multiband
applications. In IEEE Electronic Components and Technology
Conference, 2004. Proceedings. 54th (Vol. 2, pp. 1866–1873).
Govind, V., Dalmia, S., Sundaram, V., White, G. E., and Swaminathan,
M. (2004). Design of multiband baluns on liquid crystalline polymer
(LCP) based substrates. In IEEE Electronic Components and Technology
Conference, 2004. Proceedings. 54th (Vol. 2, pp. 1812–1818).
Qiu, Y., Xia, L., and Yang, L. (2015). A compact bandpass filter using
multilayer LCPtechnology. In Communication Problem-Solving (ICCP),
IEEE International Conference on (pp. 243–245).
Lan, Y., Xu, Y., Mei, T., Wu, Y., and Xu, R. (2016). A 2∼ 18GHz
compact microwave band-pass filter suitable for planar and threedimension
flexible integration. In Microwave Conference (EuMC), 2016
th European (pp. 528–531).
Keramat, M. (1997). Yield Optimization of Electronic Circuits via
Improved CG Algorithm. In IEEE 40th Midwest Symp CAS.
Yun, W., Sundaram, V., and Swaminathan, M. (2007). High-Q embedded
passives on large panel multilayer liquid crystalline polymer-based
substrate. IEEE transactions on advanced packaging, 30(3), 580–591.
Bavisi, A., Swaminathan, M., and Mina, E. (2007). Liquid crystal
polymer-based planar lumped component dual-band filters for dual-band
WLANsystems. In IEEE Radio andWireless Symposium, (pp. 539–542).
Hwang, S. E. (2011). Characterization and design of embedded passive
circuits for applications up to millimeter-wave frequency (Doctoral
dissertation, Georgia Institute of Technology).
